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TEST CAPABILITIES FOR WAFER AND PACKAGED IC _____________

ID MOS uses multi-site test capabilities for IC manufacturing. Wafer probing and IC final test are performed with regards to product quality and cost compromise. In-process yield monitoring is performed for cost continous improvement. High and Low temperature testing is also available.

 

 

         

 

         
         
Probers
          Electroglass EG1034X
Testers
        Wentworth AWP1050
Tektronix S3270            
Schlumberger S15
S92
         
Minato M9200        
Handlers
IMS XL2
XL100
        Temptronic TP452A
Teradyne A370         Multitest MT8704
MT8501
MT8203
MT8202
MT8503
Applicos ATX7002        

 

 

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